SEMICON Russia 2011 (G)
Landsberger Str. 396
ACCRETECH is a world-leading equipment supplier to the semiconductor industry.
Our key products are Wafer Prober, Dicing systems, Polish Grinder and Edge Grinder.
Our flagship Wafer Probers, the UF3000EX, UF2000 and UF200R feature industry-leading accuracy, throughput and reliability.
For Blade-Dicing we offer the full range from semi-automatic 6` version up to full-automatic twin spindle models for up to 300mm wafer size.
Our MAHOH Laser Dicer is industry leader for completely dry, dust-free wafer cutting.
Our Polish Grinder systems achieve 15μώ-m wafer thickness including stress release.